CHIPS
Accelerating GAA Logic Yield Optimization With Digital Twins
The global semiconductor industry is facing a significant challenge in manufacturing at advanced nodes. As transistors shrink to the size of
Chips (714)
CHIPS
Intel's 18A Platform Gains Momentum
At the 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits, Intel Foundry showcased its front-end silicon process innovation, highlightin
CHIPS
Cross-Vendor IP Network Simulation Pilots Advance
ZTE and China Telecom Guangdong have successfully progressed with pilots for simulating IP networks across different vendors. This collabora
CHIPS
Amazon to Sell AI Chips to Challenge Nvidia
Amazon Web Services is in talks to sell its Trainium AI chip to other companies for use in data centers, potentially challenging Nvidia's do
CHIPS
Next-gen 128TB SSDs to Squeeze Data on the Fly
Longsys has unveiled a new smart chip, the WM8500, enabling next-generation SSDs to compress data in real-time. The chip is set to be used i
CHIPS
AMD's AI Solution to RAM Shortage
AMD has acquired Mext, a company that specializes in flash-based memory expansion, to address the growing memory demands of AI applications.
CHIPS
Your GPU is Degrading Faster Than Expected
Graphics processing units are a crucial component of modern computers, handling demanding tasks like gaming and video editing. Over time, GP
CHIPS
AMD's Radeon RX 9070 XT GPU Gains Unexpected Popularity
Steam's latest survey reveals AMD's flagship GPU is more widely used than expected, challenging Nvidia's dominance in the market. The data w
CHIPS
Wi-Fi Flies Higher with Edge AI Expansion
Edge AI is transforming the way data is processed, with more being handled locally to reduce the risk of leakage and theft. This shift is dr
CHIPS
Nvidia's RTX 50-series Launch Defies Traditional Upgrade Wisdom
The latest Nvidia graphics cards are rewriting the rules of the gaming world. The company's RTX 50-series launch marks a significant shift i
CHIPS
TSMC Unveils Breakthrough Chip Packaging Technology
Taiwan Semiconductor Manufacturing Company is developing a new chip packaging technology called CoPoS, or Chip-on-Panel-on-Substrate. This i
CHIPS
AI Incident Tools Lack Critical Layer, Warns PagerDuty's CAIO
Artificial intelligence is enabling software teams to deploy code at unprecedented speeds. However, this increased velocity also raises the