Frore Systems has introduced a new line of diamond-infused water-cooling coldplates engineered specifically for the extreme thermal demands of Nvidia's Rubin architecture. The company announced the LiquidJet Diamond product line on October 12, 2026, targeting high-density AI server deployments.
The new coldplates address a critical bottleneck in modern AI infrastructure. As chip power consumption climbs to 2,300W, conventional cooling methods struggle to manage intense heat flux. Frore's solution incorporates diamond material into the coldplate structure, dramatically improving heat transfer efficiency.
The engineering challenge centers on localized heat concentration. Individual hotspots on the Rubin chip can reach 770 watts per square centimeter. Standard copper or aluminum coldplates often fail under this load, leading to thermal throttling and reduced performance. By infusing diamond, Frore claims to reduce operating temperatures by up to 22 degrees Celsius compared to traditional solutions. This temperature drop extends component lifespan and maintains peak computational throughput.
Diamond possesses roughly five times the thermal conductivity of copper. When integrated into a water-cooling coldplate, it rapidly moves heat away from the chip die. Frore designed the LiquidJet Diamond as a bespoke solution for custom-built AI servers. The company emphasizes that this is not a drop-in replacement for standard air-cooled systems. It requires integration into liquid cooling loops already present in data centers.
What is the maximum temperature reduction achieved? The diamond-infused coldplates reduce operating temperatures by up to 22 degrees Celsius. This significant drop helps prevent thermal throttling during sustained AI workloads.
Which chips are these coldplates designed for? They are specifically engineered for Nvidia's 2,300W Rubin architecture. The design targets the extreme heat flux patterns unique to next-generation AI accelerators.
When will the LiquidJet Diamond be available? Frore Systems announced the product line in October 2026. Availability details for custom server integrations are being finalized with enterprise customers.